Reasons to Use Moldex3D Chip Encapsulation
Capabilities of Moldex3D Chip Encapsulation for IC Packaging
Reasons to Use Moldex3D Chip Encapsulation
- Provides innovative and complete tools to help you gain insight into plastic encapsulation processes
- Visualizes the thermoset resin filling and curing processes and their critical characteristics, such as warpage, wire sweep, and paddle shift
- Enables package and mold design validation and optimization to reduce manufacturing costs and design cycle time
- Offers simulation-driven design of complex and innovative IC packages
Capabilities of Moldex3D Chip Encapsulation for IC Packaging
- Enables the building of high-quality models through the use of a customized preprocessor for IC packages
- Provides the characteristics of parametric modeling and compatibility with comma-separated values files to help you save energy and time when building models
- Brings the complex rheology and curing reaction of EMCs into a simulation as an excellent solution for chip encapsulation process problems
- Visualizes the filling and curing processes, detects potential defects (e.g., air traps and weld lines), and optimizes runner and gate designs
- Visualize wire sweeps caused by the drag force of resin flow exerted on wires
- Prevents short circuits, broken wires, and other problems resulting from wire crossing
- Predicts paddle deflection caused by pressure drops during mold filling
- Calculates warpage by examining the correlation of components, resins, and their properties (e.g., the coefficient of linear thermal expansion of various materials and the pressure-volume-temperature-cure model of the molding compound)
- Brings flexibility and insight into products and the real-world performance of wire sweeps and paddle shifts with the help of structural analysis software
