Contact Us Today!
(630) 778-7773
Underfill / Expert
Contact Us Today!
(630) 778-7773
Underfill/Expert
Underfill / Expert

Our Underfill and Expert Analysis Products

Moldex3D Underfill

Underfill Analysis

This software product can simulate capillary flow, which is influenced by the following:

  • Surface tension of an encapsulant
  • Contact angle among the encapsulant, bumps, and substrate of the dispensing process for flip-chip underfill

Underfill also allows you to input real dispensing procedures and predict the locations of voids in the underfill process to increase productivity.

Moldex3D Expert

Expert Analysis

Expert evaluates the appropriate settings of runner size, gate location, and optimal process conditions for injection molding part designs. This tool uses the design of experiments method to make the molding process more efficient and optimized.

Contact us today for more information about our plastics engineering software.