Moldex3D Software offers a complete and comprehensive suite of software products which accurately predicts the conditions of plastic parts during the molding and curing process. Moldex3D offers many different modules and levels of software including 3D Solid, 2.5D Shell and the new Voxel Hybrid mesh Quick Flow product for designers.
The explicit analysis capabilities of Moldex3D Flow give you deep insight in plastic flow behaviors from macro view to micro view, such as fountain flow, inertia effect and gravity effect. With the power of Moldex3D Flow, you can clearly understand how melt flow progresses, accurately identify where weld surfaces are, and detect short shot problems, etc.
Using Moldex3D Pack, even for thick parts or parts with big thickness changes, you can also investigate all factors in packing process from material choice, gate design, and processing conditions. With true 3D technology, it can help you to preciously determine gate freeze time, efficient packing time and proper packing pressure to minimize areas of high volumetric shrinkage.
Based on true 3D technology, Moldex3D Cool is an efficient tool to accurately analyze the mold temperature, the efficiency of cooling channel layout and the required cooling time in the design phase.
Based on the filling, packing and cooling analyses by Moldex3D Flow, Pack, Cool, Moldex3D Warp allows users to perform true 3D warpage analysis on thick parts and those parts that have extreme thickness changes. With Warp, users can easily and efficiently improve the part quality and optimize design. For fiber-filled material, Warp incorporates fiber composite theories and the fiber orientation results from Fiber to predict its anisotropic shrinkage and warpage. Furthermore, Warp links with I2 modules to interface with structural analysis software.
Multi-Component Molding MCM
Multi-component molding is one of the greatest methods to diversify the development of the plastic molded product fabrication. Moldex3D MCM simulates the multiple components molding process, including insert molding, overmolding and multi-shot sequential molding. Based on true 3D technology, explicit analysis capabilities of Moldex3D MCM give you a powerful tool to accurately analyze the interaction behavior of different components and further optimize product design. Moreover, this module helps you to predict the warpage due to property mismatch of different materials, prolonged cooling time and unsymmetrical shrinkage in two-color or overmolding processes…etc.
Moldex3D Fiber precisely simulates 3D fiber orientation and calculates process-induced anisotropic thermo-mechanical properties for fiber-reinforced plastic parts. With its accurate warpage prediction, users can achieve cost reduction and strength improvement.
Moldex3D Designer develops a complete series of powerful pre-processing tools, including the automatic mesh generator and intelligent modeling wizards, to help users create True 3D mesh models efficiently and setup a variety of simulation conditions easily, such as gates, runners, cooling channels, etc. It highly improves user friendliness and efficiency. With Moldex3D Designer, designers are able to verify and optimize design changes more effectively and more flexibly.
The three major concerns of industrial CAE users are accuracy, computation speed and user-friendliness. True 3D simulation not only satisfies those concerns, but offers more advantages that conventional 2.5D cannot reach, such as CAD integration, accuracy, minimized model simplification…etc. However, true 3D simulation inevitably increases computation time and requests more memory. Although the High-Performance Finite Volume Method, HPFVM, employed by Moldex3D eDesign has already outperformed other 3D software, but users are still eagerly expecting significant improvements.
Advanced Hot Runner
Hot runner solutions have been utilized in various plastic injection molded products, such as bumpers, automotive instrument panels and LCD/TV panels. Advantages hot runner molds bring include material and energy cost savings and shorter cycle times, for the runners that are eliminated in the process. However, hot runner systems are comparatively more complex and commonly face the challenge of elaborate temperature control and the risk of thermal degradation of plastic materials.
Moldex3D Injection Compression helps users accurately simulate the injection compression molding process, generally applied to thin and flat products, such as light guide plates or CD disks. The effects of key process conditions, including delay time and compression gap, on cavity pressure and volume shrinkage distributions can be simulated and visualized.
Co-Injection Molding Moldex3D Co-Injection provides powerful modeling solutions to estimate shrinkage and warpage concerning the interaction between skin and core materials. It helps to detect potential defective locations with high temperature and stress. Users can obtain insights of critical characteristics of the process such as material interface and distribution.
Gas-Assisted Injection Molding
Moldex3D Gas-Assisted Injection Molding (GAIM) visualizes 3D flow behaviors when the gas is injected into the cavity through the melt entrance or specific gas entrances. Typical gas injection molding issues, such as fingering effects, blow-through or corner effect, can be predicted to help users investigate the real production process and increase manufacturability.
Microcellular Injection Molding (MuCell®)
Microcellular injection molding, known commercially as the MuCell® process, is capable of mass-producing parts with complex geometries and excellent dimensional stability, and is widely used in automotive, electronic/electrical products, construction, outdoor products and many other applications. In this process, supercritical fluid (SCF), usually nitrogen (N2) or carbon dioxide (CO2), is mixed with polymer melt to create a single-phase polymer/gas solution, which is then injected into the mold cavity, and finally bubbles are formed in the product.
Plastics (Polymeric) fluids are often called viscoelastic fluids because they have both viscous and elastic properties. The viscoelastic effect is dependent on different temperatures and shear-rates. At filling stage, flow field varies severely, and viscous property of polymer dominates flow behavior.
Moldex3D Optics provides an analysis for optical components, including birefringence, retardation and polarization. Integrated with CODE V, Moldex3D Optics also enables users to simulate non-uniform refractive index more precisely for high-quality lens production.
Plastic encapsulation of IC components is a process where an integrated circuits chip is being capsulated with Epoxy Molding Compound (EMC) via the transfer molding process to prevent physical damage or corrosion. In addition to the complex chemorheology of EMC, the electronic components with sophisticated and fine design have brought the challenges and uncertainty to encapsulation processes. Common defects of chip encapsulation include incomplete fill, voids, wire sweep, paddle shift and package warpage.
Underfill can simulate the capillary flow, which is influenced by the surface tension of encapsulant and the contact angle among encapsulant, bumps and substrate of dispensing process for flip chip underfill. Moldex3D Underfill allows users to input real dispensing procedure and predict the locations of voids in underfill process, to highly increase productivity.
Expert is a professional tool that helps users evaluate the appropriate settings of runner size, gate location and optimal process conditions for injection molding part designs. Using the DOE (Design of Experiment) method, it brings more efficient molding optimization.
Stress provides complete stress simulation capabilities for parts and part inserts. By setting up boundary conditions on meshes, such as stress or force, structural performance can be accurately visualized and analyzed, avoiding potential quality problems.
FEA Interface is a series of FEA interface modules integrated with leading structural CAE software, including ABAQUS, ANSYS, LS-DYNA, Marc, Nastran and Radioss. The modules help users evaluate process-induced properties, such as residual stress or temperature, for structural FEA meshes.
ScrewPlus provides the accurate prediction on melt volume and temperature distributions with the process-induced effects in the screw and barrel to help users evaluate the screw performance and its optimal design.