1952 McDowell Road
Naperville, IL 60563
The three major concerns of industrial CAE users are accuracy, computation speed and user-friendliness. True 3D simulation not only satisfies those concerns, but offers more advantages that conventional 2.5D cannot reach, such as CAD integration, accuracy, minimized model simplification…etc. However, true 3D simulation inevitably increases computation time and requests more memory. Although the High-Performance Finite Volume Method, HPFVM, employed by Moldex3D eDesign has already outperformed other 3D software, but users are still eagerly expecting significant improvements.
Moldex3D eDesign takes the lead in parallel computing to enhance the computation performance and perform analyses in less time on more complex model with larger element count than ever. The high-performance parallelized kernel is equipped integrated analyses of Flow, Pack, Cool, Warp, Fiber Orientation and RIM (Reactive Injection Molding). Furthermore, Moldex3D eDesign parallel computing technology supports both Multi-CPU platform and PC-Cluster.
For optical parts, fiber-reinforced automobile components, connectors, gears…etc., the demand for high accuracy and high speed computation can never be underestimated. Computation speed can be improved by newer and more powerful CPU. However, improvement from CPU clock rate alone cannot satisfy industrial users in speed nor accuracy. Utilization of multiple CPU is therefore the most effective approach.
Moldex3D, the leading professional CAE for injection molding, is the ONLY one offering the entire parallel computing support in Flow, Pack, Cool, Warp, Fiber, MCM, and so on. By utilizing the strength of multi-Core or multi-CPU, the time required for analysis is greatly shortened. For example, the computing efficiency is enhanced up to fifty to eighty percent on general dual-core PC, even much more. Moldex3D parallel computing lowers your cost and contributes to outstanding performance.
The parallel computing of Moldex3D requires distributed systems with high performance interconnects. The amount of data passed between processors in a typical Moldex3D run could be in hundreds to thousands megabytes. The followings are the basic system requirements.