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Plastic encapsulation of IC components is a process where an integrated circuits chip is being capsulated with Epoxy Molding Compound (EMC) via the transfer molding process to prevent physical damage or corrosion. In addition to the complex chemorheology of EMC, the electronic components with sophisticated and fine design have brought the challenges and uncertainty to encapsulation processes. Common defects of chip encapsulation include incomplete fill, voids, wire sweep, paddle shift and package warpage.
Moldex3D Encapsulation provides comprehensive 3D solutions that help engineers to analyze the complicated physical phenomena inherent in encapsulation processes and further optimize the design and process.
|Melt front result as mold is 45% filled.||In wire sweep simulation, deformed wires are compared and contrasted with original wires with wire sweep index.|
Moldex3D Chip Encapsulation provides innovative and complete tools for users to gain the sights of plastic encapsulation processes. The filling and curing processes of the thermoset resins, along with all the critical characteristics including warpage, wire sweep and paddle shift can all be visualized by the software. From Moldex3D Chip Encapsulation, you can benefit on